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Non - Silicon Thermally Conductive Pad Without Fiberglass Reinforcement Application Case
- Jul 12, 2017 -

Thermally Conductive Pad is widely used in the thermal interface materials to silica gel or Polyolefin Copolymer as the carrier, filled with high thermal conductivity powder such as ceramic powder, alumina and so on. The Thermally Conductive Pad is used to fill the heat source with the heat sink to optimize the heat dissipation effect. The difference between a non-silicon Thermally Conductive Pad and a conventional Thermally Conductive Pad is that the non-silicon Thermally Conductive Pad does not contain silicone components, no low molecular siloxane content, does not volatilize and contaminates the surrounding electronic components, is suitable for silicon-sensitive Use of electronic products. In view of the specific application requirements, but also to non-silicon Thermally Conductive Pad to add other requirements such as adhesive to increase viscosity, increase the reinforcement material to enhance the tear resistance and operability. Here we have to analyze a non-silicon Thermally Conductive Pad without fiberglass reinforcement case.

The author of a German customer for industrial computer design thermal management program requires the use of non-silicon Thermally Conductive Pad. Because non-silicon Thermally Conductive Pad is to meet the notebook computers, projectors and OA office electronics, high-end industrial and medical electronics, automotive engine control equipment, telecommunications hardware and equipment and other special areas of demand, and after two high-temperature chemical treatment, And vacuum treatment, completely solve the problem of oil leakage of a non-traditional Thermally Conductive Pad, will not affect the stable operation of the computer. I recommend this to the German customers thermal conductivity 3.0W / mK non-silicon Thermally Conductive Pad XK-PN30. The non-silicon Thermally Conductive Pad has a good softness, good paste, help out the interface between the air, increase the effective contact area; thermal resistance than the traditional thermal silicone film to be 25% lower; breakdown voltage More than 10kV / mm, the above characteristics, the customer is very satisfied with the product, but in the end raised a question: non-silicon Thermally Conductive Pad XK-PN30 why no reinforcement material? No reinforcement is not easy to install the operation?

We for non-silicon Thermally Conductive Pad in the application of industrial computer to explain to customers the reasons for not applicable fiberglass reinforcement. First, the fiberglass cloth itself does not have thermal performance; Secondly, any material has thermal resistance, even if we use the current thinnest 30um fiberglass cloth, will greatly increase the thermal resistance of non-silicon Thermally Conductive Pad. Industrial computer power than the average office computer power, will produce greater heat, which prompted its cooling performance must be more rapid and more effective. The thermal resistance of non-fiberglass non-silicon thermally conductive gaskets is lower than that of non-silicon thermal insulators with less than one third of the thermal resistance. In addition, change the installation method, some users will tear off the protective film on both sides and then install, because the product is soft, does affect the operability, we recommend that the size of the die-cut, Installed in the CPU or heat sink and then tear off the protective film, so there is no inconvenient to install the problem. Finally, the increase in glass wear on the Thermally Conductive Pad has a greater improvement, but in the practical application of this function also need to be specific analysis. Industrial computer CPU and the radiator will not be loose after the fixed, the vibration is also very small, so the basic can ignore the wear resistance of the Thermally Conductive Pad requirements, more consideration of its cooling effect.