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Silicone Thermally Conductive Pad Industry Application
- Sep 27, 2017 -

Silicone Thermally Conductive Pad has a certain flexibility, excellent insulation, compression, the surface of the natural viscosity, specifically for the use of the gap heat transfer design of the production program, to fill the gap to complete the heat and heat dissipation between parts of the heat transfer, such Products can be arbitrarily cut, to help meet the automated production and product maintenance. Silicone thermal insulation pad of the process thickness ranging from 0.5mm ~ 5mm, every 0.5mm a plus, that is 0.5mm 1mm 1.5mm 2mm ~ 5mm, special requirements can be increased to 15mm, specifically for the use of the gap heat transfer design of the production, Fill the gap, the completion of the heat and heat dissipation parts of the heat transfer, but also play a role in shock insulation and sealing, to meet the small size of the system of ultra-thin design requirements, is a great process and the use of new materials and was Widely used in electrical and electronic products.

With thermal conductivity, insulation, shock performance, soft surface of the surface comes with micro-viscosity, easy to operate, can be used in a variety of irregular parts surface and radiator, shell, etc. between the thermal filling effect. Some thermal silica gel with glass fiber (or carbon fiber) to increase its mechanical strength.

Silicone Thermally Conductive Pad has a certain flexibility, excellent insulation, compression, the surface of the natural viscosity, specifically for the use of the gap heat transfer design of the production program, to fill the gap to complete the heat and heat dissipation between parts of the heat transfer, such Products can be arbitrarily cut, to help meet the automated production and product maintenance. Silicone thermal insulation pad of the process thickness ranging from 0.5mm ~ 5mm, every 0.5mm a plus, that is 0.5mm 1mm 1.5mm 2mm ~ 5mm, special requirements can be increased to 15mm, specifically for the use of the gap heat transfer design of the production, Fill the gap, the completion of the heat and heat dissipation parts of the heat transfer, but also play a role in shock insulation and sealing, to meet the small size of the system of ultra-thin design requirements, is a great process and the use of new materials and was Widely used in electrical and electronic products.

With thermal conductivity, insulation, shock performance, soft surface of the surface comes with micro-viscosity, easy to operate, can be used in a variety of irregular parts surface and radiator, shell, etc. between the thermal filling effect. Some thermal silica gel with glass fiber (or carbon fiber) to increase its mechanical strength.

Industry applications: used in power supply, LCD / PDP TV, LED lighting, automotive electronics, optoelectronics, notebook computers and other industries. The traditional thermal conductivity material is a thermal grease.