silicone cooling pad in stock

DG-3000 fills the microscopic irregularities of the components due to its superior wetting properties, resulting in very low thermal resistance.

SF600 is a 5.0W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or...

Filler thermal interface material with great thermal performance and high compliancy. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or topography. Naturally tacky, it...

SF400 is a high cost performance gap filling thermal conductive gasket with 2.5W/mK thermal conductivity. It is ultra soft and allows the pad to fill in air voids and air gaps between contact surface with rough surfaces. The product is naturally tacky and easy to operate....

SF300 is a high cost performance gap filling thermal conductive gasket with 2.0W/mK thermal conductivity. It is ultra soft and allows the pad to fill in air voids and air gaps between contact surface with rough surfaces. The product is naturally tacky and easy to operate....

Gap filling thermal conductive gasket with 3.0W/mK thermal conductivity. It is ultra soft and allows the pad to fill in air voids and air gaps between contact surface with rough surfaces. The product is naturally tacky and easy to operate. Features And Benefits Thermal...

SF500G is a 3.5 W/mK soft gap filler thermal interface material with great thermal performance and high compliancy. And it maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness or...

SG-560 is silicone based, high performance thermal grease designed to meet the high end CPUs, GPUs and custom chip assembly.

Description The high rate of compliancy of SF100 is a thermal conductivity of 1.5 W/mK. It is ultra soft for low thermal resistance at very low pressures, and allows the pad to fill in air voids and air gaps between contact surface with rough surfaces and high stack-up...