Tel: +86-769-22479425

E-mail: tina@u-sheen.com

Thermal AB Gel Adhesive with High Thermally Conductivity Used with Dispensing Equipment

Thermal AB Gel Adhesive with High Thermally Conductivity Used with Dispensing Equipment

SE series thermally conductive gel is a soft silicone resin thermally conductive gap filling material, with high thermally conductivity, low heat resistant and good thixotropism, it is a ideal material used for the big gap tolerance application occasions. The thermally conductive gel is filled...

Send Inquiry
Product Details

SE series thermally conductive gel is a soft silicone resin thermally conductive gap filling material, with high thermally conductivity, low heat resistant and good thixotropism, it is a ideal material used for the big gap tolerance application occasions. The thermally conductive gel is filled between the cooling electronic components and heat sinks/shells to make it contact well, reduce heat resistance and lower the temperature of the electronic components quickly and efficiently to extend the use life of electronic components, and enhance its reliability. This series product has one component and two-component, can be applied by manual process or dispending equipment.


Features And Benefits

Thermal Conductivity 2.0W/mK

Designed for low-stress applications

Excellent adhesive properties

Easy to operate and reusable

Available for various requirements


Configurations Available

Paste form (Canning or Syringe)


Applications

Semiconductors to heat sink Telecommunications equipment Graphics cards

Memory modules

LED solid state lighting Power electronics

LCD and PDP flat panel TV Computer, network server


Operating Instructions

Printing the Thermally conductive gel on the cleaning surface of units

Used to "Form-In-Place" and silk-screen printing


Thermally Conductive Gel

Properties

SE250AB

SE300AB

SE30

SE35

Test Method

Color

Pink

Pink

Pink

Pink

Visual

Extrusion speed(30cc EFD cartridges 1”orifice 90psi)

8 g/min

8 g/min

10 g/min

12 g/min

-

Specific Gravity (g/cc)

2.8 g/cc

2.8 g/cc

2.8 g/cc

2.9 g/cc

ASTM D792

Si molecular precipitation amount (D3-D12)

< 300PPM

GB/T 27843-2011

The thickness of minimum interface

0.09 mm

-

Shelf Life

12 month

-

Operating Temperature

-50℃ to 200℃

-

UL Fire rating

94 V0

UL 94

Thermally conductivity

2.5 W/mk

3.0 W/mk

3.0 W/mk

3.5 W/mk

ASTM D5470

Thermal Resistance @40mil, 20psi

0.54℃-in2/W

0.5℃-in2/W

0.49℃-in2/W

0.42℃-in2/W

ASTM D5470

Dielectric Breakdown Voltage

>200 VAC/mil

ASTM D149

Volume Resistivity

1*1013 ohm-cm

ASTM D257

Dielectric Constant @1MHz

5.5

ASTM D150


If you're satisfied with our thermal ab gel adhesive with high thermally conductivity used with dispensing equipment, welcome to contact us. As one of the leading manufacturers and suppliers in China, we also offer the customized service. Please be free to wholesale the quality products made in China with us.

Related Products
Inquiry